IN DEVELOPMENT
This product is currently in development – for more detailed information on availability, feel free to get in touch.
Overview
The Andromeda XZU70 SoM merges powerful AMD Zynq™ UltraScale+ MPSoC with fast DDR4 ECC SDRAM memory, eMMC flash, dual parallel quad SPI flash, and high-speed communication interfaces (dual Gigabit Ethernet PHY and USB 3.0). This combination creates a robust and powerful embedded processing solution, making it suitable for a wide range of applications from high-speed data acquisition to embedded vision, industrial automation, and telecommunications networks.
Highlights
- Built around AMD Zynq™ Ultrascale+ MPSoC
- DDR4 SDRAM with Error Correction Code (ECC)
- 19.2 GByte/sec memory bandwidth
- Offers several PCIe Gen2 and Gen3 (up to x16), USB 3.0 and 2 x Gigabit Ethernet interfaces
- Three ADM6-60 Samtec connectors with a total of 202 user I/Os
- Linux BSP and tool chain coming soon
- Powerful and compact FPGA board
Benefits
- A complete and powerful embedded processing system in a compact, space-saving form factor
- Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
- High-bandwidth data transfer: PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0 at low integration cost
- High number of transceivers available for various communication protocols
- High number of user I/Os and FPGA logic resources for powerful applications
- Support for Linux operating system
Features
- AMD Zynq™ Ultrascale+ MPSoC
- ARM® quad-core Cortex™-A53
- ARM® dual-core Cortex™-R5F
- Mali-400MP2 GPU
- H.264 / H.265 Video Codec (only for EV models)
- 16nm FinFET+ FPGA fabric
- Up to 8 GB DDR4-2400 x72 ECC memory (PS)
- Up to 8 GB DDR4-2666 x32/x64 memory (PL0)
- Up to 8 GB DDR4-2666 x32/x64 memory (PL1)
- 64 MB QSPI flash (PS)
- 16 GB eMMC flash (PS)
- PCIe® Gen3 ×16 and PCIe Gen2 ×4
- Up to 32 × 6/16.3 Gbit/s MGT
- 2 × Gigabit Ethernet (PS and PL)
- USB 2.0 PHY (USB 3.0 using PS GTR)
- Up to 653,000 LUT4-eq
- Up to 202 user I/Os
- 156 HP I/O
- 24 HD I/O
- 22 MIO
- 12 V power input
- 30A core power supply
- Andromeda form factor L (80 ×64 mm)
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
| Product Code | MPSoc | MGT's | DDR4 ECC SDRAM (PS) | Temp. Range | Status |
|---|---|---|---|---|---|
| AM-XZU70-7EV-2I-D4E | XCZU7EV-2FFVF1517I | 24 GTH @ 16.3 Gbps | 8GB | -40 to +85C |
|
| AM-XZU70-11EG-2I-D4E | XCZU11EG-2FFVF1517I | 32 GTH @ 16.3 Gbps | 8GB | -40 to +85C |
|
Key: 
Mass Production 
Sampling 
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
Operating System Support
The OS support is in development
Target Applications
- High-speed data acquisition
- Embedded vision systems and AI
- Software Defined Radio (SDN)
- High-Performance Computing
- Real-time image processing
- Data Center Acceleration
Information on the product may change, please check the manufacturers website and page for the most up to date information, see the link at the top right of this page.
