Overview
The Mars AX3 FPGA module is equipped with a powerful, low-cost Xilinx Artix-7™ 28nm FPGA, Gigabit Ethernet, and fast DDR3 SDRAM, making it perfectly suited for high-speed communication and DSP applications.
The SO-DIMM form factor allows space-saving hardware designs, and speedy, simple integration of the FPGA board into the target application.
Highlights
- Low-cost, low-power FPGA of the latest generation
- 35k-100k logic cells, 40k-120k flip-flops and 90-240 DSP slices
- Uses the widely-supported and compact SO-DIMM form factor
- Supports Gigabit Ethernet and analog inputs
- Available in industrial temperature range
- Powerful and compact FPGA board
Benefits
- Simple, low-cost and rugged assembly, in the industry-standard SO-DIMM form factor
- Simple and low-cost integration due to the on-board Gigabit Ethernet interface
- Fast boot times and support for execution-in-place (XiP) due to the 4 bit parallel SPI Flash
- Lowest power consumption due to the high-efficiency DC/DC converters
- Many IP cores are available from Xilinx, Enclustra and third parties.
Features
- Xilinx Artix-7 28nm FPGA
- SO-DIMM form factor (67.6 x 30 mm, 200 pins)
- 108 user I/Os
- 92 single-ended or differential I/Os
- 16 single-ended, differential or analog I/Os (8 auxiliary differential analog channels)
- 1 dedicated differential analog channel
- 64 MB quad SPI Flash
- 256 MB DDR3 SDRAM
- Gigabit Ethernet PHY
- 3.3 V tolerant inputs
- Single 3.3V supply voltage
- Migration from Mars MX1/MX2 FPGA modules possible with some restrictions. Please contact us for information.
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
| Product Code | FPGA | Quad SPI Flash | DDR3L SDRAM | Ethernet PHY | Temp Range | Status |
|---|---|---|---|---|---|---|
| MA-AX3-35-1I-D8 | XC7A35T-1CSG324I | 64MB | 256MB | 1Gbps | -40C. +85C |  |
| MA-AX3-50-1I-D8 | XC7A50T-1CSG324I | 64MB | 256MB | 1Gbps | -40C. +85C |  |
| MA-AX3-100-2I-D8 | XC7A100T-2CSG324I | 64MB | 256MB | 1Gbps | -40C. +85C | |
Key: Mass Production 
Sampling Contact us
Mars Heatsink
The Mars heat sink is an optimal solution to cool the Mars AX3 – it’s low profile (less than 7 mm tall) and covers the whole module surface. It comes with a gap pad for the FPGA and four screws to attach it to the module PCB. With additional user configured gap pads, it is possible to cool other components on board as well.
To cool the module even further, a mounting slot in the center of the heat sink makes it easy to attach fans of different sizes – see the technical drawing for details.
Base Boards
| Base Board | Description |
|---|---|
| Mars ST3 | An ideal platform for display applications |
| Mars EB1 | An ideal platform for a stereo frame grabber and other video applications. |
| Mars PM3 | A powerful platform with a wealth of I/O interfaces: Ethernet, USB 3.0, FMC low pin count and more. |
Target Applications
- Data Acquisition
- High-Speed Communications
- Digital Signal Processing
- Image Processing
- Embedded Computing
Information on the product may change, please check the manufacturers website and page for the most up to date information, see the link at the top right of this page.
